World’s leading trade fair and conference for electronics Electronica 2018 was held in Munich from 13th till 16th of November. One of the interesting news that we got from there is collaboration of Actility and Microchip Technology with a goal of helping manufactures to accelerate the time needed for their IoT device getting to the market.
There’s 60 national or large scale LPWAN IoT networks all around the world powered by Actility’s ThingPark Wireless platform. There’s a ThingPark Connected inter test program for hardware, devices and applications, covering multiple regions, LoRaWAN versions and device classes – it looks up for standard compliance, but also ensures E2E performance on ThingPark Wireless networks in real world conditions. Microchip saw market opportunity here and developed SAM R34 System-in-Package (SiP) so any manufacturer using it could be certain that its device is fully interoperable with ThingPark Wireless network.
Read the full news story here.